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Outstanding cooling effect!
Due to the increase in the capacity of components, air cooling methods are reaching their limits. Our oxygen-free copper water-cooled heat sinks, with a thickness of 6 to 20 mm, are about one-tenth the size of air cooling!! They provide several times the cooling effect per unit area and contribute to space-saving.
We will introduce the concerns about heat sinks submitted to WELCON!
WELCON's heat sinks enable uniform cooling and are characterized by their high cooling performance with minimal refrigerant usage. In this document, we will introduce the concerns related to heat sink cooling that have been raised by our company, which has been involved for many years in the planning, method examination, analysis verification, prototype development, evaluation, and mass production of heat sinks.
A must-see for those struggling with heat generation! Introducing uniform cooling and low refrigerant heat sinks.
Due to the increase in computational load and high output, the heat generated by chips and light sources has increased, and we often hear the following concerns: - Air cooling cannot sufficiently cool the high heat generation. - I want to try water cooling, but I wonder if it will leak. - Considering carbon neutrality, I want a cooling method that reduces environmental impact and power consumption. Therefore, we are releasing a brochure on heat sinks as a reference for considering water cooling! Please feel free to download the brochure.
Technical documentation regarding the last bastion of heat dissipation, "water-cooled products" <<Manufacturing range/materials/case studies, etc.>> *Thermal analysis services available!*
We would like to introduce the water-cooled products we handle. They can accommodate high heat generation, making them suitable for high-heat components such as IGBTs. Additionally, they are more compact compared to air-cooled systems, allowing for effective utilization of internal space. We have examples of products related to linear applications using AL6063 and copper pipes, as well as inverters with a heat generation of 1,500W. 【Features】 ■ Silent operation possible → Usable in clean rooms ■ More compact compared to air-cooled systems → Effective utilization of internal space ■ Capable of handling high heat generation → Suitable for high-heat components such as IGBTs *For more details, please refer to the PDF document or feel free to contact us.
Flow path design to achieve uniform cooling
Water is circulated inside a metal plate to cool the entire plate, and a heating element is attached to absorb heat. This is primarily used for cooling semiconductor devices such as IGBTs, as well as for various applications and industries including UV-LEDs, amplifiers, and Peltier elements. The performance of water-cooled heat sinks varies significantly depending on the flow path structure and the machining precision of the element surface. Our company is committed to efficient and uniform cooling within the plane, and we design and manufacture water-cooled heat sinks that meet your desired performance and shape.
With a thermal conductivity more than 20 times that of air, it absorbs heat from heating elements! We design and manufacture heat sinks tailored to your needs based on application, shape, size, and material!
Water is circulated inside a metal plate to cool the entire plate, and a heating element is attached to absorb heat. This is mainly used for cooling semiconductor devices such as IGBTs, as well as for various applications and industries including UV-LEDs, amplifiers, and Peltier elements. The performance of water-cooled heat sinks varies significantly depending on the flow path structure and the machining precision of the element surface. Our company is committed to designing flow paths that efficiently and uniformly cool the surface, and we design and manufacture water-cooled heat sinks that meet your desired performance and shape.
